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BS PD ES 59008-4-3:2000 PDF

BS PD ES 59008-4-3:2000 PDF

Name:
BS PD ES 59008-4-3:2000 PDF

Published Date:
03/15/2000

Status:
Active

Description:

Data requirements for semiconductor die. Specific requirements and recommendations-Thermal

Publisher:
BSI Group

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
bs-pd-es-59008-4-3-2000_1109781
Choose Document Language:
$48.01
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Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures and minimally-packaged semiconductor die. Specifies requirements of operational thermal conditions of unpackaged and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in it's use.

Cross References:
IEC 60050
EN/IEC 60068-2
IEC 60617-1
IEC 60617-12
IEC 60617-13
SEMI G42-0996
SEMI G68-0996
SEMI G43-87
SEMI G32-94
EIA/JESD5
EIA/JESD10
EIA/JESD24
EIA/JESD41
EIA/JESD45
EIA/JESD51-4
EIA-531
JEP110
EIA/JESD51-1
MIL-STD-883
MIL-STD-750D
ISO 9000
ES 59008-1
ES 59008-2
ES 59008-3


Replaced by BS EN 62258-6:2006 but remains current.

All current amendments available at time of purchase are included with the purchase of this document.

File Size : 1 file , 610 KB
ISBN(s) : 0580341844
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 12
Product Code(s) : 19978913, 19978913, 19978913
Published : 03/15/2000

History

BS PD ES 59008-4-3:2000
BS PD ES 59008-4-3:2000
Published Date: 03/15/2000
Data requirements for semiconductor die. Specific requirements and recommendations-Thermal
$48.01

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