BS PD IEC TR 63378-1:2021 PDF

BS PD IEC TR 63378-1:2021 PDF

Name:
BS PD IEC TR 63378-1:2021 PDF

Published Date:
01/11/2022

Status:
Active

Description:

Thermal standardization on semiconductor packages-Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Publisher:
BSI Group

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:
bs-pd-iec-tr-63378-1-2021_2244436

Choose Document Language:
$79.25
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This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

All current amendments available at time of purchase are included with the purchase of this document.


File Size : 1 file , 2.4 MB
ISBN(s) : 9780539171525
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 24
Product Code(s) : 30434821, 30434821, 30434821
Published : 01/11/2022

History


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