Metal-clad base materials for printed wiring boards-Adhesive coated polymeric films: PETP-F-15 and PI-F-15
Document status: Active
Specification for metal-clad base materials for printed circuits-Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade: EP-GC-Cu-2
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Specification for metal-clad base materials for printed circuits-Phenolic cellulose paper copper-clad laminated sheet, economic grade: PF-CP-Cu-4
Document status: Active
Metal-clad base materials for printed wiring boards-Specification for economic quality phenolic cellulose paper copper-clad laminated sheet
Document status: Active
Specification for metal-clad base materials for printed circuits-Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality, flame retardant grade: PF-CP-Cu-6
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Metal-clad base materials for printed wiring boards-Specification for phenolic cellulose paper copper-clad laminated sheet of high electrical quality
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Specification for metal-clad base materials for printed circuits-Flexible copper-clad polyester (PETP) film: PETP-F-Cu-9
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Methods of test for spices and condiments. Determination of extraneous matter
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Methods of test for spices and condiments-Determination of extraneous matter
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Methods of test for spices and condiments-Determination of water-insoluble ash
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