Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Document status: [ Revised ]
Printed board assemblies Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Document status: [ Active ]
Workmanship requirements for soldered electronic assemblies - Part 1: General
Document status: [ Withdrawn ]
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
Document status: [ Withdrawn ]
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
Document status: [ Withdrawn ]
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
Document status: [ Withdrawn ]
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
Document status: [ Withdrawn ]
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
Document status: [ Active ]
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
Document status: [ Active ]
Quality assessment systems Part 3: Selection and use of sampling plans for printed boards and laminate end-products and in-process auditing
Document status: [ Active ]
