Printed boards and printed board assemblies - Design and use Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
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Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
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Printed boards and printed board assemblies - Design and use Part 7: Electronic component zero orientation for CAD library construction
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 1: General test methods and methodology
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
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