Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section four: Family specification for complementary MOS digital integrated circuits, series 4000 B and 4000 UB
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Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section five: Blank detail specification for complementary MOS digital integrated circuits (series 4000 B and 4000 UB)
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Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section Six: Blank detail specification for microprocessor integrated circuits
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Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section seven: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories
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Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section Eight: Blank detail specification for integrated circuit static read/write memories
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Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
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Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
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Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination
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Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
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Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
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