Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test methods for interconnection structures (printed boards) - Electronic circuit board for high-brightness LEDs
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Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
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Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
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Specification for finished fabric woven from "E" glass for printed boards
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Qualification and performance of electrical insulating compound for printed wiring assemblies
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Qualification and performance specification of permanent solder mask and flexible cover materials
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Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-29: Examinations and measurements - Measurement techniques for characterizing the amplitude of the spectral transfer function of DWDM components
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Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-35: Examinations and measurements - Fibre optic cylindrical connector endface visual inspection
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Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-38: Group delay and chromatic dispersion
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Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-43: Examinations and measurements - Mode transfer function measurement for fibre optic sources
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