Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin
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Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin
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Base materials for printed circuits -- Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test)
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"Copper-clad laminates for printed wiring boards -- Paper base, phenolic resin"
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Base materials for printed circuits -- Paper base, phenolic resin
Document status: Active
Base materials for printed circuits -- Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)
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Base materials for printed circuits -- Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
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Base materials for printed circuits -- Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
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Base materials for printed circuits -- Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
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Base materials for printed circuits -- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
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