Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
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General rules of prepreg for multilayer printed wiring boards
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Test methods of prepreg for multilayer printed wiring boards
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Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth
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Prepreg for multilayer printed wiring boards -- Modified or unmodified polyimide resin-impregnated glass cloth
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Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-Impregnated glass Cloth
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Miniature fuses -- Part 1: Definitions of miniature fuses and general requirements for miniature fuse-links
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