POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant (Noncurrent: Jan 1993)
Document status: Active
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Heat Cure, Machinable (Noncurrent: Jan 1993)
Document status: Active
POTTING COMPOUND, EPOXY Bisphenol A-Type Impregnating Resin, Heat Cure, Single Component (Noncurrent: Jan 1993)
Document status: Active
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm (Noncurrent: Jan 1993)
Document status: Active
POTTING COMPOUND, EPOXY Bisphenol A-Type Syntactic Foam, Heat Cure (Noncurrent: Jan 1993)
Document status: Active
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage (Noncurrent: Jan 1993)
Document status: Active
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Heat Cure, High HDT (Noncurrent: Jan 1993)
Document status: Active
POTTING COMPOUND, EPOXY Flexible, Thermal Shock Resistant, Heat Cure (Noncurrent: Jan 1993)
Document status: Active
POTTING COMPOUND, EPOXY Bisphenol A-Type (Noncurrent: Jan 1993)
Document status: Active
Potting Compound, Epoxy One Part, Filled, Heat Cure, Low Cte (Noncurrent: Jan 1993)
Document status: Active
