Potting Compound, Epoxy, Two Part, Highly Filled, Heat Cure, High Compressive Strength (Noncurrent: Jan 1993)
Document status: Active
Potting Compound, Epoxy, Unfilled General Purpose Room Temperature Cure
Document status: Active
Potting Compound, Epoxy, Filled 10 - 15 Cte, 225 Hdt
Document status: Active
Potting Compound, Epoxy, Filled 25 - 30 Cte, 175 Hdt Room Temperature Cure
Document status: Active
Potting Compound, Epoxy, Unfilled 35 - 40 Cte, 160 Hdt Room Temperature Cure
Document status: Active
Potting Compound, Epoxy, Filled 15 - 20 Cte, 180 Hdt
Document status: Active
POTTING COMPOUND, EPOXY, FILLED 15 – 20 GTE, 225 HDT Free Machining
Document status: Active
Potting Compound, Epoxy, Filled 15 - 20 Cte, 225 Hdt Free Machining
Document status: Active
