CEI EN 50173-4/A2 PDF

Name:
CEI EN 50173-4/A2 PDF

Published Date:
02/01/2014

Status:
[ Revised ]

Description:

Information technology - Generic cabling systems Part 4: Homes

Publisher:
Comitato Elettrotecnico Italiano

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This European Standard specifies generic cabling in homes, installed to support one or more of the following groups of applications and based upon balanced, coaxial and optical fibre cabling as appropriate:

Edition :	08
File Size :	1 file , 200 KB
Number of Pages :	16
Published :	02/01/2014

History

Related products

CEI 46-10

Published Date: 10/01/1997

Cavi, cordoni e fili per telecomunicazioni a bassa frequenza, isolati con PVC - Fili e cordoni per permutazione con conduttori massicci, isolati con PVC, con rivestimento di poliammide, singoli od a coppia, terna, quarta e quinta

$8.1

CEI EN IEC 60747-16-6

Published Date: 02/01/2020

Semiconductor devices Part 16-6: Microwave intregrated cricuits - Frequency multipliers

$19.5

CEI EN 61580-6

Published Date: 12/01/1998

Methods of measurement for waveguides - Part 6: Return loss on waveguide and waveguide assemblies

$7.8

CEI EN 61334-4-512

Published Date: 12/01/2002

La presente Norma recepisce il testo originale inglese della Pubblicazione IEC e pertanto consta delle sole pagine dispari.

$25.2

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

$12.6

IEC/PAS 60050-732 Ed. 1.0 b:2007

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

$61.2

IEC/PAS 60092-510 Ed. 1.0 en:2009

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

$89.7

IEC/PAS 60099-7 Ed. 1.0 en:2004

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

$95.1

IEC/PAS 60191-6-18 Ed. 1.0 en:2008

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

$29.1

IEC/PAS 60191-6-19 Ed. 1.0 en:2008

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

$32.1