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CEI EN 60068-2-69 PDF

CEI EN 60068-2-69 PDF

Name:
CEI EN 60068-2-69 PDF

Published Date:
10/01/2017

Status:
[ Active ]

Description:

Environmental testing Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$35.1
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BILINGUAL

This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes.

The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.

This document provides the measurement procedures for solder alloys both with and without lead (Pb).


Edition : 17
File Size : 1 file , 1.5 MB
Number of Pages : 62
Published : 10/01/2017

History

CEI EN 60068-2-69
CEI EN 60068-2-69
Published Date: 10/01/2017
Environmental testing Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
$35.1
CEI EN 60068-2-69
CEI EN 60068-2-69
Published Date: 03/01/2008
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
$28.2

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