Name:
CEI EN 61189-5-4 PDF
Published Date:
05/01/2016
Status:
[ Active ]
Publisher:
Comitato Elettrotecnico Italiano
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering.
| Edition : | 16 |
| File Size : | 1 file , 1.9 MB |
| Number of Pages : | 32 |
| Published : | 05/01/2016 |
