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CEI EN 61189-5-4 PDF

CEI EN 61189-5-4 PDF

Name:
CEI EN 61189-5-4 PDF

Published Date:
05/01/2016

Status:
[ Active ]

Description:

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$13.5
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This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering.


Edition : 16
File Size : 1 file , 1.9 MB
Number of Pages : 32
Published : 05/01/2016

History

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