CEI EN 61191-3 PDF

Name:
CEI EN 61191-3 PDF

Published Date:
01/01/2018

Status:
[ Active ]

Description:

Printed board assemblies Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Publisher:
Comitato Elettrotecnico Italiano

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Edition :	18
File Size :	1 file , 2 MB
Number of Pages :	30
Published :	01/01/2018

History

CEI EN 61191-3

Published Date: 01/01/2018

Printed board assemblies Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

$17.7

CEI EN 61191-3

Published Date: 03/01/2005

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

$15.3

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