Name:
CEI EN IEC 60749-5 PDF
Published Date:
04/01/2024
Status:
[ Active ]
Publisher:
Comitato Elettrotecnico Italiano
This part of IEC 60749 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments.
This test method is considered destructive.
| Edition : | 24# |
| File Size : | 1 file , 1.5 MB |
| Number of Pages : | 18 |
| Published : | 04/01/2024 |