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CEI EN IEC 61760-2 PDF

CEI EN IEC 61760-2 PDF

Name:
CEI EN IEC 61760-2 PDF

Published Date:
05/01/2022

Status:
[ Active ]

Description:

Surface mounting technology Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Czech version):
200 business days
SKU:
cei-en-iec-61760-2_2753628
Choose Document Language:
13.50 €
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ENGLISH

This International Standard specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)

The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".


Edition : 22#
File Size : 1 file , 2.4 MB
Number of Pages : 24
Published : 05/01/2022

History

CEI EN IEC 61760-2
CEI EN IEC 61760-2
Published Date: 05/01/2022
Surface mounting technology Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
13.50 €
CEI EN 61760-2
CEI EN 61760-2
Published Date: 04/01/2008
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
10.50 €

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