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DANSK DS/EN 60068-2-69 PDF

DANSK DS/EN 60068-2-69 PDF

Name:
DANSK DS/EN 60068-2-69 PDF

Published Date:
07/02/2007

Status:
[ Withdrawn ]

Description:

Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$33
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This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.


Edition : 07
File Size : 1 file , 620 KB
Number of Pages : 62
Product Code(s) : DS-031, DS-031
Published : 07/02/2007

History

DANSK DS/EN 60068-2-69
DANSK DS/EN 60068-2-69
Published Date: 06/06/2017
Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
$30.3
DANSK DS/EN 60068-2-69
DANSK DS/EN 60068-2-69
Published Date: 07/02/2007
Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
$33

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