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DANSK DS/EN IEC 61189-5-601 PDF

DANSK DS/EN IEC 61189-5-601 PDF

Name:
DANSK DS/EN IEC 61189-5-601 PDF

Published Date:
03/15/2021

Status:
[ Active ]

Description:

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-601: General test methods for materials and assemblies – Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$27
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SAME AS IEC 61189-5-601

IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys. The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts). The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering.


Edition : 21
File Size : 1 file , 3 MB
Number of Pages : 50
Product Code(s) : DS-041, DS-041
Published : 03/15/2021

History

DANSK DSF/PREN IEC 61189-5-601
DANSK DSF/PREN IEC 61189-5-601
Published Date:
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-601: General test methods for materials and assemblies – Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
$14.7
DANSK DS/EN IEC 61189-5-601
DANSK DS/EN IEC 61189-5-601
Published Date: 03/15/2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-601: General test methods for materials and assemblies – Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
$27

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