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DANSK DSF/PREN IEC 61189-5-601 PDF

DANSK DSF/PREN IEC 61189-5-601 PDF

Name:
DANSK DSF/PREN IEC 61189-5-601 PDF

Published Date:

Status:
[ Draft-Obsolete ]

Description:

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-601: General test methods for materials and assemblies – Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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$14.7
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DRAFT * W/D S/S BY DS/EN IEC 61189-5-601

This document specifies the reflow soldering ability test method components mounted on the organic rigid printed boards, reflow heat resistance test method for the organic rigid printed boards, and reflow soldering ability test method for the organic rigid printed boards land in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheet that be specified in IEC61249-2 series. The objective of this standard is to ensure that the solder joint and the printed boards land soldering ability. In addition, test methods are provided to ensure that the printed boards can resist against the heat load to which it is exposed during soldering.


Edition : 19
File Size : 1 file , 1.5 MB
Number of Pages : 39
Product Code(s) : DSF-036, DSF-036

History

DANSK DSF/PREN IEC 61189-5-601
DANSK DSF/PREN IEC 61189-5-601
Published Date:
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-601: General test methods for materials and assemblies – Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
$14.7
DANSK DS/EN IEC 61189-5-601
DANSK DS/EN IEC 61189-5-601
Published Date: 03/15/2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-601: General test methods for materials and assemblies – Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
$27

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