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DANSK DSF/FPREN IEC 61189-2-501 PDF

DANSK DSF/FPREN IEC 61189-2-501 PDF

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DANSK DSF/FPREN IEC 61189-2-501 PDF

Published Date:

Status:
[ Draft-Obsolete ]

Description:

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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$8.7
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DRAFT * W/D S/S BY DS/EN IEC 61189-2-501

This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.


Edition : 21
File Size : 1 file , 1.7 MB
Number of Pages : 18
Product Code(s) : DSF-009, DSF-009

History

DANSK DSF/PREN IEC 61189-2-501
DANSK DSF/PREN IEC 61189-2-501
Published Date:
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials
$8.7
DANSK DSF/FPREN IEC 61189-2-501
DANSK DSF/FPREN IEC 61189-2-501
Published Date:
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
$8.7
DANSK DS/EN IEC 61189-2-501
DANSK DS/EN IEC 61189-2-501
Published Date: 03/21/2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
$18

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