Name:
DANSK DSF/PREN IEC 61189-2-501 PDF

Published Date:

Status:
[ Draft-Obsolete ]

Description:

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

Publisher:
Dansk Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

DRAFT * W/D S/S BY DS/EN IEC 61189-2-501

This International Standard establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.

Edition :	20
File Size :	1 file , 1.4 MB
Number of Pages :	17
Product Code(s) :	DSF-009, DSF-009

History

DANSK DSF/PREN IEC 61189-2-501

Published Date:

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

$8.7

DANSK DSF/FPREN IEC 61189-2-501

Published Date:

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

$8.7

DANSK DS/EN IEC 61189-2-501

Published Date: 03/21/2022

$18

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