DIN 45325-2 PDF

Published Date: 01/01/1983

Rotary wafer switches (12 × 31) mm, 12 positions; soldering terminals, rectangular to the driving shaft; dimensions, ratings, requirements, tests

Published Date: 08/01/1997

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections; sectional specification; section 1: Capability detail specification; performance levels A, B and C (IEC 62326-4-1:1996); German version EN 62326-4-1:1997

Published Date: 07/01/2023

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020

Published Date: 03/01/2009

Connectors for electronic equipment - Tests and measurements - Part 16-1: Mechanical tests on contacts and terminations - Test 16a: Probe damage (IEC 60512-16-1:2008); German version EN 60512-16-1:2008

Published Date: 01/01/2001