DIN EN IEC 60749-20 PDF

Published Date: 07/01/2023

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020

Published Date: 10/01/2019

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019

Published Date: 10/01/2019

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019

Published Date: 04/01/2010

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009

Published Date: 10/01/2007

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/1916/CDV:2007); German version prEN 60749-20:2007

Published Date: 12/01/2003

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2002 + Corr. 1:2003); German version EN 60749-20:2003

Published Date: 12/01/2003

Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003

Published Date: 05/01/2008

Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 47/1961/CD:2008)

Published Date: 01/01/2011

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 60749-32:2002 + Cor. :2003 + A1:2010); German version EN 60749-32:2003 + Cor. :2003 + A1:2010

Published Date: 02/01/2023

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020

Published Date: 09/01/1996

Published Date: 12/01/1995

Published Date: 03/01/1987

Published Date: 10/01/1991

Published Date: 04/21/2000

Published Date: 11/01/1992