DIN EN 60191-6-13 - DRAFT PDF

Published Date: 06/01/2017

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016

Published Date: 07/01/2013

Draft Document - Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/834/CD:2013)

Published Date: 04/01/2008

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 60191-6-13:2007); German version EN 60191-6-13:2007

Published Date: 09/01/1989

Two-part connectors for printed boards, grid 2.5 mm; gauges, ratings, requirements, tests

Published Date: 07/01/1987

Electrical communications engineering; connectors with two rows of contacts, connection box and connector, 4- and 8poles; types, dimensions

Published Date: 09/01/1991

Harmonized system of quality assessment for electronic components; detail specification: metallized polyethylene terephthalate film capacitors DC 63 to 400 V, long life grade, rectangular shape, insulated, radial terminations for printed circuits, climatic category 55/100/56 (CECC 30401-054)

Published Date: 12/01/2011

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011

Published Date: 2007