DIN EN 60191-6-13 PDF

Published Date: 06/01/2017

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016

Published Date: 07/01/2013

Draft Document - Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/834/CD:2013)

Published Date: 04/01/2008

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 60191-6-13:2007); German version EN 60191-6-13:2007

Published Date: 06/01/2005

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482.6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units (IEC 60297-3-101:2004); German version EN 60297-3-101:2004

Published Date: 06/01/2017

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016

Published Date: 01/01/2011

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482.6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1 (IEC 60297-3-106:2010); German version EN 60297-3-106:2010

Published Date: 04/01/2019

Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 2: Method for the determination of forced air cooling (IEC 62610-2:2018); German version EN IEC 62610-2:2018

Published Date: 02/01/1995

Published Date: 10/01/2001