DIN EN 61837-2 - DRAFT PDF

Published Date: 06/01/2021

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018 + A1:2020); German version EN IEC 61837-2:2018 + A1:2020

Published Date: 12/01/2020

Draft Document - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1338/CDV:2020); German and English version EN IEC 61837-2:2018/prA1:2020

Published Date: 02/01/2019

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018); German version EN IEC 61837-2:2018

Published Date: 10/01/2017

Draft Document - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1218/CD:2017)

Published Date: 10/01/2014

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011 + A1:2014); German version EN 61837-2:2011 + A1:2014

Published Date: 08/01/2013

Draft Document - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1028/CD:2013)

Published Date: 04/01/2012

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011); German version EN 61837-2:2011

Published Date: 09/01/2001

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2000); German version EN 61837-2:2000

Published Date: 01/01/1971

Case 6 A 3 for semiconductor devices; main dimensions

Published Date: 02/01/2002

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001

Published Date: 03/01/2008

Draft Document - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 47D/708/CD:2007)

Published Date: 09/01/2009

Draft Document - Mechanical structures for electronic equipment - Outdoor enclosures - Part 1: Design guidelines (IEC 48D/397/CD:2009)

Published Date: 07/24/2001

Published Date: 01/01/1977

Published Date: 06/14/1996

Published Date: 05/24/1999

Published Date: 05/24/1999

Published Date: 05/24/1999