DIN EN IEC 61837-2 PDF

Published Date: 06/01/2021

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018 + A1:2020); German version EN IEC 61837-2:2018 + A1:2020

Published Date: 12/01/2020

Draft Document - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1338/CDV:2020); German and English version EN IEC 61837-2:2018/prA1:2020

Published Date: 02/01/2019

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018); German version EN IEC 61837-2:2018

Published Date: 10/01/2017

Draft Document - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1218/CD:2017)

Published Date: 10/01/2014

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011 + A1:2014); German version EN 61837-2:2011 + A1:2014

Published Date: 08/01/2013

Draft Document - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1028/CD:2013)

Published Date: 04/01/2012

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011); German version EN 61837-2:2011

Published Date: 09/01/2001

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2000); German version EN 61837-2:2000

Published Date: 09/01/2000

Mechanical structures for electronic equipment - Outdoor enclosures - Part 2-2: Detail specification; dimensions for cases (IEC 61969-2-2:2000); German version EN 61969-2-2:2000

Published Date: 02/01/2009

Draft Document - Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/732/CD:2008)

Published Date: 05/01/2009

Draft Document - Piezoelectric filters of assessed quality - Part 3: Standard outlines and lead connections (IEC 49/838/CD:2009)

Published Date: 01/28/2009

Railway applications — Fire protection on railway vehicles — Part 5: Fire safety requirements for electrical equipment including that of trolley buses, track guided buses and magnetic levitation vehicles