DIN EN IEC 61190-1-3 PDF

Published Date: 09/01/2018

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018

Published Date: 04/01/2011

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007 + A1:2010); German version EN 61190-1-3:2007 + A1:2010

Published Date: 11/01/2007

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007); German version EN 61190-1-3:2007

Published Date: 11/01/2003

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies (IEC 61192-2:2003); German version EN 61192-2:2003

Published Date: 12/01/2017

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017

Published Date: 11/01/2014

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014

Published Date: 10/01/2021

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019); German version EN IEC 62878-1:2019

Published Date: 05/01/2002

New York Building Code

Published Date: 08/01/2010

Building Code of New York State

Published Date: 08/01/2007

New York Building Code

Published Date: 11/01/2019

2020 Building Code of New York State

Published Date: 09/01/2022

2022 New York City Building Code

Published Date: 10/01/2022

2022 New York City Fire Code