Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007); German version EN 61190-1-3:2007

Publisher:
DIN-adopted European Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

File Size :	1 file
Note :	This product is unavailable in Russia, Ukraine, Belarus
Number of Pages :	39
Product Code(s) :	1380837, 1380837
Published :	11/01/2007

History

DIN EN IEC 61190-1-3

Published Date: 09/01/2018

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018

$44.799

DIN EN 61190-1-3

Published Date: 04/01/2011

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007 + A1:2010); German version EN 61190-1-3:2007 + A1:2010

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DIN EN 61190-1-3

Published Date: 11/01/2007

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