DIN EN IEC 61191-1 PDF

Published Date: 06/01/2019

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018

Published Date: 02/01/2014

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013); German version EN 61191-1:2013

Published Date: 04/01/2013

Draft Document - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 91/1089/FDIS:2013); German version FprEN 61191-1:2013

Published Date: 06/01/1999

Printed board assemblies - Part 1: Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:1998); German version EN 61191-1:1998

Published Date: 11/01/2009

Draft Document - Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys (IEC 91/879/CD:2009)

Published Date: 10/01/2018

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1.0 W/(m·K) and defined flammability (vertical burning test), copper-clad for

Published Date: 01/01/2018

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017); German version EN 61189-5-503:2017

Published Date: 03/01/2022

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English

Published Date: 11/27/2000