DIN IEC 62341-5 - DRAFT PDF

Published Date: 12/01/1983

Sectional specification for rotary wafer switches for telecommunication

Published Date: 07/01/1998

Connectors for frequencies below 3 MHz for use with printed boards - Part 1: Generic specification: General requirements and guide for the preparation of detail specifications, with assessed quality (IEC 60603-1:1991 + A1:1992); German version EN 60603-1:1998

Published Date: 02/01/2020

Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 60749-18:2019); German version EN IEC 60749-18:2019

Published Date: 03/01/2006

Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability (IEC 61249-4-5:2005); German version EN 61249-4-5:2005

Published Date: 09/30/2014

Published Date: 09/30/2014