ECIA 534 PDF

BACKGROUND AND PURPOSE

Leaded Electronic Component parts are subjected to a wide variety of internal stresses during the soldering of their terminations by solder dips, soldering irons, or automatic wave soldering techniques. The heat can either be conducted through the metal termination into the body of the component part, or absorbed directly or indirectly as radiant heat emanating from solder baths, waves or preheaters, or both. This document is intended as a guide for users of leaded electronic component parts that exist today. Furthermore, recommendations are given on the cleaning, retinning, packaging and storage of these component parts. it is recognized that many components behave differently during installation and lead retinning operations. Hermetically sealed components must be treated differently from non-hermetic sealed types. Other solder compositions than those recommended in this guide may be used. Solder irons of different mass and tip temperatures may be used providing the end result is not detrimental to the component. This document is intended as a guideline only and in many cases manufacturers' suggested procedures should be used.