Name:
ECIA EIA-364-31D PDF
Published Date:
07/01/2014
Status:
[ Revised ]
Publisher:
Electronic Components Industry Association
The purpose of these tests is to evaluate materials and/or connector/socket assemblies as they are impacted by the effects of high humidity and heat. These tests are intended to be non-condensing.
| ANSI : | ANSI Approved |
| Edition : | D |
| File Size : | 0 files |
| Number of Pages : | 18 |
| Published : | 07/01/2014 |