Name:
ECIA EIA-364-31F PDF
Published Date:
01/01/2019
Status:
[ Active ]
Publisher:
Electronic Components Industry Association
The purpose of these tests is to evaluate materials and/or connector/socket assemblies as they are impacted by the effects of high humidity and heat. These tests are intended to be non-condensing.
| ANSI : | ANSI Approved |
| Edition : | F |
| File Size : | 1 file , 420 KB |
| Number of Pages : | 21 |
| Published : | 01/01/2019 |