ETSI TS 122 281 PDF

Published Date: 11/01/2020

LTE; 5G; Mission Critical (MC) video (3GPP TS 22.281 version 16.0.0 Release 16)

Published Date: 07/01/2018

LTE; Mission Critical Video over LTE (3GPP TS 22.281 version 15.1.0 Release 15)

Published Date: 04/01/2018

LTE; Mission Critical Video over LTE (3GPP TS 22.281 version 14.4.1 Release 14)

Published Date: 01/01/2018

LTE; Mission Critical Video over LTE (3GPP TS 22.281 version 14.4.0 Release 14)

Published Date: 03/01/2017

LTE; Mission Critical Video over LTE (3GPP TS 22.281 version 14.3.0 Release 14)

Published Date: 08/01/2020

Digital cellular telecommunications system (Phase 2+) (GSM); Universal Mobile Telecommunications System (UMTS); LTE; Telecommunication management; Requirements template (3GPP TS 32.155 version 16.0.0 Release 16)

Published Date: 09/01/2018

CYBER; Critical Security Controls for Effective Cyber Defence; Part 3: Service Sector Implementations

Published Date: 08/01/2020

Universal Mobile Telecommunications System (UMTS); Synchronisation in UTRAN Stage 2 (3GPP TS 25.402 version 16.0.0 Release 16)

Published Date: 01/01/2021

LTE; Functional architecture and information flows to support Mission Critical Data (MCData); Stage 2 (3GPP TS 23.282 version 16.8.0 Release 16)

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage