ETSI TS 129 594 PDF

Published Date: 01/01/2021

5G; 5G System; Spending Limit Control Service; Stage 3 (3GPP TS 29.594 version 16.4.0 Release 16)

Published Date: 01/01/2021

5G5G; 5G System; Spending Limit Control Service; Stage 3 (3GPP TS 29.594 version 15.8.0 Release 15)

Published Date: 11/01/2020

5G; 5G System; Spending Limit Control Service; Stage 3 (3GPP TS 29.594 version 16.3.0 Release 16)

Published Date: 11/01/2020

5G; 5G System; Spending Limit Control Service; Stage 3 (3GPP TS 29.594 version 15.7.0 Release 15)

Published Date: 08/01/2020

5G; 5G System; Spending Limit Control Service; Stage 3 (3GPP TS 29.594 version 16.2.0 Release 16)

Published Date: 08/01/2020

5G; 5G System; Spending Limit Control Service; Stage 3 (3GPP TS 29.594 version 15.6.0 Release 15)

Published Date: 10/01/2019

5G; 5G System; Spending Limit Control Service; Stage 3 (3GPP TS 29.594 version 15.5.0 Release 15)

Published Date: 03/01/1999

Digital cellular telecommunications system (Phase 2+) (GSM); Support of Optimal Routeing (SOR); Service definition (Stage 1) (GSM 02.79 version 5.2.0 Release 1996)

Published Date: 09/01/2019

Smart Cards; Test specification for the Single Wire Protocol (SWP) interface; Part 2: UICC features (Release 12)

Published Date: 03/01/2009

Universal Mobile Telecommunications System (UMTS); LTE; Universal Subscriber Identity Module Application Toolkit (USAT) interpreter protocol and administration (3GPP TS 31.114 version 8.0.0 Release 8)

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage