GMW GMW16552 PDF

Purpose/Material Description.

This standard defines the GM Supplier Hardware Change Management Process for Semiconductor Part Changes. This process is the means by which the Electrical Component/Subsystem Supplier shall propose changes directly to GM, or to GM and GMʹs Integration Supplier when there is an Integration Supplier, due to unexpected Part Shortages, part ʺend of lifeʺ, part modifications, etc. This process does not apply to changes, made due to a change request from GM, that affect functions or features, changes to correct non-compliances, etc. The Electrical Component/Subsystem Supplier is defined as a supplier who receives electrical requirements from GM.

The Supplier Hardware Change Management Process for Semiconductor Part Changes is to be used as a method for communicating the technical viability of a change proposal for any electrical component/subsystem. Any approval authority stated herein shall apply only to the technical element of the proposed change. This process does not replace the Engineering Work Order (EWO), Engineering Change Request (ECR) or any other GM cost and investment process where the supplier receives authorization to change piece price, investment, etc. Also, this process does not replace any Production Part Approval Process (PPAP) or supplier quality requirements and processes.