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BS IEC 62047-31:2019 PDF

BS IEC 62047-31:2019 PDF

Name:
BS IEC 62047-31:2019 PDF

Published Date:
04/17/2019

Status:
Active

Description:

Semiconductor devices. Micro-electromechanical devices-Four-point bending test method for interfacial adhesion energy of layered MEMS materials

Publisher:
British Standard / International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$57.15
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BS IEC 62047-31:2019 specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered micro-electromechanical systems (MEMS) based on the concept of fracture mechanics. In a variety of MEMS devices, there are many layered material interfaces, and their adhesion energies are critical to the reliability of the MEMS devices.

Cross References:
IEC 62047-2:2006
IEC 62047-3:2006


All current amendments available at time of purchase are included with the purchase of this document.
File Size : 1 file , 1.5 MB
ISBN(s) : 9780580966606
Number of Pages : 14
Product Code(s) : 30352563, 30352563, 30352563
Published : 04/17/2019

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