IEC 60027-1 Ed. 6.0 b COR. 1:1993 PDF

Published Date: 02/01/2023

Fixed resistors for use in electronic equipment – Part 2: Sectional specification: Low-power film resistors with leads for throughhole assembly on circuit boards (THT)

Published Date: 12/01/2023

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

Published Date: 12/14/2010

Fibre optic interconnecting devices and passive components - Performance standard - Part 086-6: Non-connectorized single-mode bidirectional 1 490 / 1 550 nm downstream and 1 310 nm upstream WWDM devices for category O - Uncontrolled environment

Published Date: 07/26/2017

Piezoelectric, dielectric and electrostatic oscillators of assessed quality - Part 1: Generic specification

Published Date: 07/20/2001

Technical specification of supply assembly for high intensity discharge lamps.

Published Date: 07/20/2001

Technical specification of supply assembly for high intensity discharge lamps of double power level.

Published Date: 04/24/2002

Polyvinyl chloride insulated cables to be used in interconnection circuits for household audio equipment.

Published Date: 07/25/2002

Specifications for the checking and aggregation system for recovered paper.

Published Date: 07/30/2008

Specifications for the checking and aggregation system for recovered paper.

Published Date: 01/31/2003

Snub elements of bundle assembled cores for low voltage overhead lines.