Name:
IEC 60749-5 Ed. 3.0 b:2023 PDF
Published Date:
12/01/2023
Status:
Active
Publisher:
International Electrotechnical Commission
This part of IEC 60749 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments.
This test method is considered destructive.
| Edition : | 3.0 |
| File Size : | 1 file , 720 KB |
| ISBN(s) : | 9782832280331 |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 22 |
| Published : | 12/01/2023 |