IEC 60191-1B Ed. 1.0 b:1970

Published Date: 01/01/1970

Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - Second supplement

$5.4

IEC 60191-2T Ed. 1.0 b:1996

Published Date: 12/20/1996

Eighteenth supplement

$3.9

IEC 60191-5 Ed. 2.0 b:1997

Published Date: 04/23/1997

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

$83.4

IEC 60191-6-5 Ed. 1.0 en:2001

Published Date: 08/27/2001

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

$15.3

1997-1998 ASTM Directory of Scientific & Technical Consultants & Expert Witnesses

Published Date: 05/01/1997

1999 ASTM International Directory of Testing Laboratories

Published Date: 12/01/1998

Acoustic Emission : Standards & Technology Update

Published Date: 10/01/1999

Advances in Fatigue Crack Closure Measurement & Analysis

Published Date: 08/01/1999

Advances in the Production and Use of Steel with Improved Internal Cleanliness

Published Date: 01/01/1999

Assessment of Remediation of Petroleum Release Sites

Published Date: 01/01/1999

Edition :	1.0
File Size :	1 file , 930 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	23
Published :	12/22/1998

IEC 60191-2V Ed. 1.0 b:1998 PDF

Twentieth supplement

History

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