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IEC 60191-5 Ed. 2.0 b:1997 PDF

IEC 60191-5 Ed. 2.0 b:1997 PDF

Name:
IEC 60191-5 Ed. 2.0 b:1997 PDF

Published Date:
04/23/1997

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$83.4
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Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
Edition : 2.0
File Size : 1 file , 570 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 71
Published : 04/23/1997

History

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