IEC 60191-3 Ed. 2.0 b:1999 PDF

IEC 60191-3 Ed. 2.0 b:1999 PDF

Name:
IEC 60191-3 Ed. 2.0 b:1999 PDF

Published Date:
10/29/1999

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$110.1
Need Help?
Gives guidance on the preparation of drawings of integrated circuits outlines.
Edition : 2.0
File Size : 1 file , 2.8 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 113
Published : 10/29/1999

History


Related products

IEC 60191-2X Ed. 1.0 b:1999
Published Date: 09/30/1999
Mechanical standardization of semiconductor devices - Part 2: Dimensions
$28.5
IEC 60191-2T Ed. 1.0 b:1996
Published Date: 12/20/1996
Eighteenth supplement
$3.9
IEC 60191-2U Ed. 1.0 b:1997
Published Date: 05/09/1997
Nineteenth supplement
$7.5
IEC 60191-5 Ed. 2.0 b:1997
Published Date: 04/23/1997
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
$83.4

Best-Selling Products

CII BMM2001-10
Published Date:
Impacts of Design/Information Technology on Building and Industrial Projects
$36
CII BMM2002-10
Published Date: 11/01/2002
Measuring the Impacts of the Delivery System on Project Performance -- Design-Build and Design-Bid-Build
$36
CII BMM2002-3
Published Date: 02/01/2002
Benchmarking and Metrics Summary Report for 2001
$36
CII BMM2004-10
Published Date: 10/01/2004
Best Practices for Project Security
$36
CII BMM2006-10
Published Date: 07/01/2006
Lessons Learned in the Implementation of Best Practices for Project Security
$36
CII BMM2006-11
Published Date: 11/01/2006
Impacts of Automation and Integration Technologies on Project and Company Performance
$36