IEC 62418 Ed. 1.0 b:2010 PDF

IEC 62418 Ed. 1.0 b:2010 PDF

Name:
IEC 62418 Ed. 1.0 b:2010 PDF

Published Date:
04/22/2010

Status:
Active

Description:

Semiconductor devices - Metallization stress void test

Publisher:
International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

Edition :	1.0
File Size :	1 file , 990 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	34
Published :	04/22/2010

History

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