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IEC 62418 Ed. 1.0 b:2010 PDF

IEC 62418 Ed. 1.0 b:2010 PDF

Name:
IEC 62418 Ed. 1.0 b:2010 PDF

Published Date:
04/22/2010

Status:
Active

Description:

Semiconductor devices - Metallization stress void test

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$43.5
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IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
Edition : 1.0
File Size : 1 file , 990 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 34
Published : 04/22/2010

History

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