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IEC 60191-6-12 Ed. 1.0 en:2002 PDF

IEC 60191-6-12 Ed. 1.0 en:2002 PDF

Name:
IEC 60191-6-12 Ed. 1.0 en:2002 PDF

Published Date:
06/14/2002

Status:
[ Withdrawn ]

Description:

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$30
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Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
Edition : 1.0
File Size : 1 file , 490 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 20
Published : 06/14/2002

History

IEC 60191-6-12 Ed. 2.0 b:2011
IEC 60191-6-12 Ed. 2.0 b:2011
Published Date: 06/08/2011
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
$43.5
IEC 60191-6-12 Ed. 1.0 en:2002
IEC 60191-6-12 Ed. 1.0 en:2002
Published Date: 06/14/2002
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
$30

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