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IEC 60191-6-13 Ed. 1.0 en:2007 PDF

IEC 60191-6-13 Ed. 1.0 en:2007 PDF

Name:
IEC 60191-6-13 Ed. 1.0 en:2007 PDF

Published Date:
06/27/2007

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$23.1
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This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.
Edition : 1.0
File Size : 1 file , 250 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 15
Published : 06/27/2007

History

IEC 60191-6-13 Ed. 1.0 b:2007
IEC 60191-6-13 Ed. 1.0 b:2007
Published Date: 06/27/2007
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
$21.9
IEC 60191-6-13 Ed. 1.0 en:2007
IEC 60191-6-13 Ed. 1.0 en:2007
Published Date: 06/27/2007
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
$23.1

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