Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

Edition :	1.0
File Size :	1 file , 640 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	53
Published :	01/27/2011

IEC 60191-6-17 Ed. 1.0 b:2011 PDF