IEC 60191-6-17 Ed. 1.0 b:2011 PDF

IEC 60191-6-17 Ed. 1.0 b:2011 PDF

Name:
IEC 60191-6-17 Ed. 1.0 b:2011 PDF

Published Date:
01/27/2011

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$70.2
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IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
Edition : 1.0
File Size : 1 file , 640 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 53
Published : 01/27/2011

History


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