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IEC 60749-19 Ed. 1.1 b:2010 PDF

IEC 60749-19 Ed. 1.1 b:2010 PDF

Name:
IEC 60749-19 Ed. 1.1 b:2010 PDF

Published Date:
11/29/2010

Status:
Active

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength CONSOLIDATED EDITION

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$15.3
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IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.
Edition : 1.1
File Size : 1 file , 190 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 13
Published : 11/29/2010

History

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