IEC 60191-6-18 Ed. 1.0 b:2010 PDF

IEC 60191-6-18 Ed. 1.0 b:2010 PDF

Name:
IEC 60191-6-18 Ed. 1.0 b:2010 PDF

Published Date:
01/07/2010

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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Choose Document Language:
$43.5
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IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
Edition : 1.0
File Size : 1 file , 1.1 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 40
Published : 01/07/2010

History

IEC 60191-6-18 Ed. 1.0 b:2010
Published Date: 01/07/2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$43.5

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